More than 1,500 attendees from around the world gathered in Honolulu, Hawaii, from 14 to 18 June for this year’s Symposium on Very-Large-Scale Integration (VLSI) Technology & Circuits (VLSI 2026), which was jointly organized by the Institute of Electrical and Electronics Engineers (IEEE) and the Japan Society of Applied Physics (JSAP). Celebrating 45 years at the forefront of microelectronics, the symposium explored how innovations in semiconductor technologies, circuits, advanced packaging and system-level integration are driving the next generation of artificial intelligence (AI) hardware.
A photograph of Lee-Chung Lu from TSMC giving a plenary talk on advanced packaging for next-generation AI system scaling.
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Source: www.nature.com
